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[Case 1] Realization of high sensitivity using 3D implemented chiplet X-ray sensors.

Successfully achieved 3D stacking of heat-sensitive sensors and semiconductor LSIs at low temperatures with ultra-high-density implementation at 50µm intervals.

How to integrate heat-sensitive image sensors with high-speed processing LSI. We solved this challenge with our unique 3D stacking technology. By 3D stacking heat-sensitive X-ray image sensors and TSV-forming LSI at low temperatures, we achieved direct bonding of the sensor pixel signal terminals. By arranging 144 sensors, each measuring 10mm on a side, with a minimal gap of 50µm, we enable large-area and high-sensitivity sensing. This is a case that condenses our know-how in utilizing silicon interposers to maximize high-speed measurement processing. *For specific processes of advanced 3D stacking technology, please refer to the materials.